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3D Circuit Board Manufacture

Description
Toyon Research Corporation

Description

Novel application of CAD sheet metal functions and neutral bend surface k-factor were exploited to precisely align circuit traces and thru-board via holes in conically shaped, thermally bonded multilayer ceramic-PTFE composite circuit boards.  Manufacturing tooling yielded the required mass quantity fabrication to meet production cost goals, and included positional float for each press cavity to prevent over-constraining conditions.


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